Communication module BGA assembly

Name:Communication module BGA assembly

Number of SMT lines:7 high-speed SMT mounter production lines

SMT daily production capacity: more than 20 million points

Inspection equipment: X-RAY detector, first chip detector, AOI automatic optical detector, ICT detector, BGA rework station

Mounting speed: chip component mounting speed (optimal state) 0.036 S/piece

The smallest package can be affixed: 0201, accuracy of ± 0.04mm

Precision of the smallest device: PLCC, QFP, BGA, CSP and other devices can be pasted, the pin spacing of up to ± 0.04mm.

IC-type placement accuracy: mounting ultra-thin PCB boards, FPCPCB boards, gold fingers, etc. with a high level. Can mount/insert/mix TFT display driver boards, cell phone
motherboards, battery protection circuits and other difficult products.