Due to the special characteristics of the BGA package form, its rework requires specialized rework tools, rework difficulty and low success rate.<\/p>\n
For electronic assembly manufacturers, to improve the quality of BGA assembly to improve product quality and reduce costs is of great significance.<\/p>\n
\u2460 BGA package form
\nThe current BGA package is mainly divided into PBGA (plastic package BGA) and CBGA (ceramic package) according to the type of substrate.
\n(PBGA package consists of chips mounted and interconnected to a double-sided or multi-layer PCB substrate, and the signal traces on the top surface are interconnected to the corresponding pads on the bottom of the substrate through vias. After chip bonding and
\nlead bonding, the assembled part is formed and packaged by transfer molding or injection molding. It is the most widely used BGA device, mainly used in communication products and consumer products. It is widely used in SMT assembly due to the following advantages:I\/O
\nhigh ratio of terminals to package area:good thermal integration performance by matching the coefficient of thermal expansion CTE of epoxy PCB:
\ngood electrical performance;high interconnect density;low requirement of solder ball coplanarity in SMT assembly, generally 0.15~0.20mm;self-centering function in SMT reflow engineering:elimination of narrow-pitch solder paste Printing;Reduce the possibility of bridging between pads.<\/p>\n
PBGA devices are highly humidity sensitive devices and must be stored under constant temperature and dry conditions to prevent the components from being affected before assembly. The ideal storage environment for general BGAs is 20-25C with less than 10% RH (preferably with nitrogen protection measures
\n). Therefore, once the BGA sealed moisture-proof package is opened, it must be assembled to the PCB within the specified time. the usage time of the PBGA chip out of the box is determined by the sensitivity level of the chip.
\nDuring assembly, the BGA package cannot be assembled within the corresponding time after it is opened, and the exposure time is more than
\nIn order to make the BGA have good solderability before the next use, it is recommended to bake the BGA. Baking temperature is generally not more than 125 \u2103, relative humidity should be less than 60%, because the temperature is too high will increase the thickness of the intermetallic compounds at the junction of the solder ball and the BGA,
\neasy to produce cracks in the assembly process, resulting in BGA assembly failure. The baking time is closely related to the moisture sensitivity of the BGA and the thickness of the BGA.<\/p>\n
PBGA solder ball components are generally available in Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3. 0 Copper 0. 5 alloys, Solder Balls
\nPitch is generally 1.50, 1.27, 1.0, 0.8, and 0.5 mln, and can be adjusted to suit the diameter of the solder ball for different applications.
\nThe required difference varies between 0.75 and 0.30 mln. For smaller pitch BGAs, the higher the package density, the higher the process requirements for BGA assembly.The interconnections of CBGAs are made with SnI0Pb90 high temperature solder balls, which are soldered to the substrate by means of low melting point solders such as Sn63Pb37,
\nSn62Pb36Ag2, Sn96.5Ag3, etc.0Cu0.5. The solder balls used when the pitch of solder ball arrays is 1.27min The diameter of the solder balls used when the pitch is 1.0mm is 0.89min, and the diameter of the solder balls used when the pitch is 1.0mm is 0.64rn\/n. The main advantages of CBGA sealing
\ninclude (1) high reliability of the encapsulated components, excellent performance: (2) good coplanarity, easy to weld; (3) insensitive to moisture, long storage time; (4) good electrical performance: (5) high density of encapsulation.The main disadvantage of CBGA is that it does not match with the PCB’s coefficient of thermal expansion CTE, which is the most important factor in the thermal expansion of the PCB.
\nThe main disadvantage of CBGA is that it does not match with the thermal expansion coefficient CTE of PCB, which is easy to cause thermal fatigue failure, so the thermal reliability is poor, the package edge is difficult to align with the PCB pads, and the packaging cost is high.
\nTBGA is a copper\/polyimide carrier tape as a substrate to realize the chip and solder balls connected to the PCB package form.
\nTBGA package has the following characteristics: (1) good thermal match with epoxy circuit boards: (2) can be aligned with the PCB pads through the package edge; (3) humidity and heat sensitivity, multi-component polymerization of different materials has an adverse effect on reliability.<\/p>","protected":false},"excerpt":{"rendered":"
Name:Communication module BGA assembly<\/p>\n
Number of SMT lines:7 high-speed SMT mounter production lines<\/p>\n
SMT daily production capacity: more than 20 million points<\/p>\n
Inspection equipment: X-RAY detector, first chip detector, AOI automatic optical detector, ICT detector, BGA rework station<\/p>\n
Mounting speed: chip component mounting speed (optimal state) 0.036 S\/piece<\/p>\n
The smallest package can be affixed: 0201, accuracy of \u00b1 0.04mm<\/p>\n
Precision of the smallest device: PLCC, QFP, BGA, CSP and other devices can be pasted, the pin spacing of up to \u00b1 0.04mm.<\/p>\n
IC-type placement accuracy: mounting ultra-thin PCB boards, FPCPCB boards, gold fingers, etc. with a high level. Can mount\/insert\/mix TFT display driver boards, cell phone
\nmotherboards, battery protection circuits and other difficult products.<\/p>","protected":false},"featured_media":1558,"comment_status":"open","ping_status":"closed","template":"","meta":{"_acf_changed":false,"_seopress_robots_primary_cat":"","_seopress_titles_title":"","_seopress_titles_desc":"","_seopress_robots_index":"","_uag_custom_page_level_css":"","site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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module BGA assembly Number of SMT lines:7 high-speed SMT mounter production lines SMT daily production capacity: more than 20 million points Inspection equipment: X-RAY detector, first chip detector, AOI automatic optical detector, ICT detector, BGA rework station Mounting speed: chip component mounting speed (optimal state) 0.036 S\/piece The smallest package can be affixed: 0201,…","_links":{"self":[{"href":"https:\/\/fabpcb.com\/es\/wp-json\/wp\/v2\/product\/1557","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/fabpcb.com\/es\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/fabpcb.com\/es\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/fabpcb.com\/es\/wp-json\/wp\/v2\/comments?post=1557"}],"version-history":[{"count":1,"href":"https:\/\/fabpcb.com\/es\/wp-json\/wp\/v2\/product\/1557\/revisions"}],"predecessor-version":[{"id":1562,"href":"https:\/\/fabpcb.com\/es\/wp-json\/wp\/v2\/product\/1557\/revisions\/1562"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/fabpcb.com\/es\/wp-json\/wp\/v2\/media\/1558"}],"wp:attachment":[{"href":"https:\/\/fabpcb.com\/es\/wp-json\/wp\/v2\/media?parent=1557"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/fabpcb.com\/es\/wp-json\/wp\/v2\/product_brand?post=1557"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/fabpcb.com\/es\/wp-json\/wp\/v2\/product_cat?post=1557"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/fabpcb.com\/es\/wp-json\/wp\/v2\/product_tag?post=1557"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}