Fee Electronic OEM PCBA Assembly Manufacturing

Fei electronic OEM PCBA assembly manufacturing
Surface treatment:HASL,Enig,OSP,Immersion gold,AG,Sn
PCBA-inspection:X-ray,AOI
Type:Rigid board
Flame retardant:VO
Processing:Electrolytic foil
Insulation:Organic resin
Material:Composite
Transportation Packaging:Carton Packaging
Specification:Copper
Number of layers:1-18 layers

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